Component retention socket

ABSTRACT

A component retention socket, which allows through-hole mount electronic components to be attached to a substrate in a stabilized, vertical orientation, without requiring lead preparation.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to apparatus and methods forattaching a component to a substrate. In particular, the presentinvention relates to a socket for attaching an electronic component to asubstrate.

[0003] 2. State of the Art

[0004] In the fabrication of electronic devices, a variety of electroniccomponents may be utilized. A number of these electronic components maybe mounted to a substrate, which is used in the fabrication of theelectronic device. Some of these electronic components are “through-holemount” (THM) components, wherein leads of the electronic componentsextend through and are attached to the substrate. The electroniccomponents may be active or passive, and may include, but are notlimited to, crystals, oscillators, capacitors, diodes, resistors, andinductors. Within this application, the term “substrate” is defined toinclude motherboards, peripheral cards, cartridges, multi-chip modulesubstrates, non-printed circuit board products, and similar structures,as will be evident to one skilled in the art.

[0005]FIG. 7 illustrates an electronic component 202 having a componentbody 204 and a pair of leads 206 extending therefrom. Generally, asshown in FIG. 8, such electronic components 202 are attached to asubstrate 208 by forming plated vias 212, as known in the art, throughthe substrate 208, wherein the plated vias 212 are attached to traces(not shown) that make contact with other electrical components (notshown). The leads 206 of the electronic component 202 are inserted intothe plated vias 212, such that they penetrate through the substrate 208.The component leads 206 are bent such that the component body 204resides against the substrate 208. The component leads 206 may be bentprior to or after insertion into the plated vias 212. The componentleads 206 are attached to the plated vias 212 using solder 214 appliedby a wave solder process, as known in the art. The component body 204may be secondarily attached to the substrate with an adhesive (notshown) and/or with a wire 218 (which encompasses the component body 204and extends through the substrate 208). The wave soldering of thecomponent leads 206 also secures the wire 218. It is, of course,understood that the secondary attachment is merely optional.

[0006] Another variation (not shown), as is known in the art, is for thecomponent leads to be fashioned such that a portion of each componentlead lies in contact with the substrate when the electronic component issurface mounted to the substrate. However, as will be known to oneskilled in the art, these components are difficult to attached to thesubstrate due to their non-symmetrical configuration which requiresplacement offsets, due to the fragility of the component leads, and/ordue to the round package configuration which may require special vacuumnozzles on the “pick and place” assembly equipment.

[0007] However, regardless of the configuration, the process of bendingthe component leads 206 results in substantial stresses on the seals(not shown) through which the component leads 206 enter the componentbody 204. These stresses may result in the fracturing of the seals,which can result in moisture infiltration that can have a performanceimpact, damage, or even destroy the electronic component 202.Furthermore, improper installation of the electronic component 202 mayresult in crossed component leads 206 that may render the electroniccomponent 202 inoperable.

[0008] It is also known in the art that electronic components can beplaced in a housing 222 to position the electronic components, as shownin FIG. 9. These electronic component housings 222 may include a chamber224 for receiving the electronic component and channels 226 forreceiving electronic component leads 228. Such electronic componenthousings 222 may be obtained from Chicago Miniature Lamp, Inc. ofHackensack, N.J., USA.

[0009] Therefore, it would be advantageous to develop apparatus andtechniques to effectively attach an electronic component to a substrate,which lessens or eliminates the problems discussed above.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] While the specification concludes with claims particularlypointing out and distinctly claiming that which is regarded as thepresent invention, the advantages of this invention can be more readilyascertained from the following description of the invention when read inconjunction with the accompanying drawings to which:

[0011]FIG. 1 is a side cross-sectional view of a first embodiment of acomponent retention socket, according to the present invention;

[0012]FIG. 2 is a top plan view of the component retention socket alonglines 2-2 of FIG. 1, according to the present invention;

[0013]FIG. 3 is another side cross-sectional view of the componentretention socket along lines 3-3 of FIG. 2, according to the presentinvention;

[0014]FIG. 4 is a side cross-sectional view of the component retentionsocket of FIG. 1 having an electronic component disposed therein,according to the present invention;

[0015]FIGS. 5a-5 f are side cross-sectional views of component retentionsockets having various embodiments of substrate attachment mechanisms,according to the present invention;

[0016]FIG. 6a is a side cross-sectional view of another embodiment of acomponent retention socket, according to the present invention;

[0017]FIG. 6b is a side cross-sectional view of the component retentionsocket along lines 6 b-6 b of FIG. 6a, according to the presentinvention;

[0018]FIG. 7 is an oblique view of an electronic component, as known inthe art;

[0019]FIG. 8 is an oblique view of an electronic component attached to asubstrate, as known in the art; and

[0020]FIG. 9 is a cross-sectional view of an electronic componenthousing, as known in the art.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENT

[0021] In the following detailed description, reference is made to theaccompanying drawings that show, by way of illustration, specificembodiments in which the invention may be practiced. These embodimentsare described in sufficient detail to enable those skilled in the art topractice the invention. It is to be understood that the variousembodiments of the invention, although different, are not necessarilymutually exclusive. For example, a particular feature, structure, orcharacteristic described herein, in connection with one embodiment, maybe implement within other embodiments without departing from the spiritand scope of the invention. In addition, it is to be understood that thelocation or arrangement of individual elements within each disclosedembodiment may be modified without departing from the spirit and scopeof the invention. The following detailed description is, therefore, notto be taken in a limiting sense, and the scope of the present inventionis defined only by the appended claims, appropriately interpreted, alongwith the full range of equivalents to which the claims are entitled. Inthe drawings, like numerals refer to the same or similar functionalitythroughout the several views.

[0022] The present invention comprises a component retention socketwhich allows through-hole mount (THM) electronic components to beattached to a substrate, such as a motherboard, in a stabilized,vertical orientation, without requiring lead preparation (cutting,forming, etc.). The invention substantially reduces the risk of handlingrelated damage to component throughout assembly process andpost-assembly. The component retention socket protects component fromdamage due to shock and vibration, and/or incidental contact.

[0023]FIGS. 1, 2, and 3 illustrates a component retention socket 100 ofthe present invention comprising a housing 102 and a recess 104 formedtherein. The socket recess 104 may comprise a component chamber 106, acomponent insertion stop 108, and a beveled guide 112 extending from afirst surface 114 of the socket housing 102 to the component chamber106. The socket recess 104 further comprises at least one lead guidechannel 116 (shown as two lead guide channels 116 and 116′) extendingfrom the component chamber 106, proximate the component insertion stop108, to a second surface 118 of the socket housing 102. The lead guidechannels 116 and 116′ include sloped walls 124 and 124′ extending fromthe component chamber 106. The sloped walls 124 and 124′ preferablyslope to a point approximately one-quarter to one-third the distancefrom the component insertion stop 108 to the housing second surface 118.

[0024] The socket housing 102 should be constructed of an electricallynon-conductive material, including polycarbonate materials, plastics,epoxy resins, nylons, and the like. The material used to construct thesocket housing 102 should have sufficient hardness such that thecomponent leads (see FIG. 4) cannot penetrate into the socket housing102 during the insertion of an electronic component 132 (see FIG. 4).The component retention socket 100 may be fabricated using an injectionmold process, milling, or other such fabrication process as will beevident to those skilled in the art. Further, the component retentionsocket 100 may be formed as a single unit, but the present invention isnot so limited. The outside of the socket housing 102 should be shapedsuch that it can be easily and securely held by human hand during theassembly onto a substrate, as will be later discussed, but could bealternately shaped for placement or handling by a tool or other suchimplement.

[0025] When more than one lead guide channel 116 is present, at leastone lead separator 122 may be positioned between each lead guide channel116 (shown positioned between lead guide channels 116 and 116′). Thelead separator 122 separates leads of a component to be inserted (seeFIG. 4) into their respective guide channels 116 and 116′, whichprevents electrical shorts due to leads coming into contact with eachother. Further, the lead separator 122 may include a separator wedge126, which also assists in properly guiding the leads of an electroniccomponent into the lead guide channels 116 and 116′.

[0026] The electronic socket 100 may include at least one substrateattachment mechanism 128 (shown as elements 128 and 128′) extending fromthe socket housing second surface 118. The substrate attachmentmechanisms 128, 128′ are illustrated as solderable posts.

[0027]FIG. 4 illustrates the electronic socket 100 of FIG. 1 abutting asubstrate 142 and having an electronic component 132 vertically orientedtherein. The electronic component 132 may be active or passive, and mayinclude, but are not limited to, crystals, oscillators, capacitors,diodes, resistors, and inductors. Leads 134, 134′ extend from a firstsurface 136 of an electronic component 132 through lead guide channels116 and 116″, respectively. The electronic component leads 134, 134′extend through vias 140 and 140′, respectively, in the substrate 142 andare attached thereto with solder 144 and 144′, respectively. Theelectronic component leads 134, 134′ may protrude from the substrate142.

[0028] It is, of course, understood that the electronic component leads134, 134′ make electrical contact with the substrate 142 when suchattachment is achieved. It is further understood that the substrate vias140, 140′ are preferably slightly larger that the lead guide 116, 116′to prevent the leads 134, 134′ from contacting the substrate 142 duringinsertion, which may cause misalignment and may result in stress oncomponent seals (discussed previously). As further shown in FIG. 4, thesubstrate attachment mechanisms 128 and 128′ (solderable posts) extendthrough vias 150 and 150′ and are also attached to the substrate 142with solder 146 and 146′, respectively.

[0029] The component chamber 106 is, preferably, designed to closelyconform to the length, width, height, and/or diameter of an electroniccomponent 132. The dimensions should allow for the easy insertion of theelectronic component 132, but limit movement of the electronic component132 inside the component chamber 106 to the minimum degree possible.

[0030] The beveled guide 112 tapers into the component chamber 106(i.e., wider proximate the socket housing first surface 114 than it isproximate the component chamber 106) to facilitate the insertion of theelectronic component 132. The bevel guide 112 preferably terminates at apoint no greater than about one-third of the electronic component lengthfrom the socket housing first surface 114. The bevel guide 112 shouldpreferably provide sufficient clearance to allow entry of an implement,such as a tweezers, to grasp the electronic component 132 (see FIG. 4)for removal.

[0031] The socket housing second surface 118 is preferably substantiallyplanar to contact the substrate 142, and is designed to consume theminimum amount of a substrate surface area necessary to providestability from the time of placement at least until the wave solderprocess. Preferably, the contact of the socket housing second surface118 with the substrate 142 also provides stability after the attachmentprocess.

[0032] The lead guide channels 116, 116′ preferably maintain a uniformdimension from the termination of the sloped wall 124, 124′ to thesocket housing second surface 118. Furthermore, the lead guide channels116, 116′ should be sized to prevent the electronic component leads 134,134′ from binding during insertion, but not large enough to allow entryof more than a single lead.

[0033] The component insertion stop 108 provides a stopping point forcomponent insertion, such that a second surface 148 of the electroniccomponent 132 is typically, but not necessarily, “flush” with the sockethousing first surface 114. The positioning of the component insertionstop 108 in combination with the length of the lead guide channels 116and 116′ are designed to allow proper penetration of the electroniccomponent leads 134, 134′ through the substrate 142. This allows for theuse of the electronic component 132 without the need to alter the sizeor shape of the electronic component leads 134, 134′, as would be neededfor horizontal assembly (as discussed above regarding prior artassembly). The elimination of the need to alter the component leads 134,134′ substantially reduces the incidence of component defects (e.g.,package seal damage) resulting from bending the component leads 134,134′ or as otherwise caused by handling.

[0034] As it will understood by those skilled in the art, theutilization of the component retention socket 100 reduces the number ofrequired manufacturing processes and operations. Moreover, the componentretention socket 100 reduces susceptibility of the electronic component132 to damage due to shock, vibration, or incidental contact, bothduring and after assembly.

[0035] It is, of course, understood that the overall height of thecomponent retention socket 100 and the properly installed electroniccomponent 132 should not exceed requisite height restrictions.

[0036] The socket housing 102 may include a positional referencemechanism (not shown) to ensure proper placement orientation ofcomponent, if necessary (e.g., polarity constraints and the like). Thereference mechanism could be a visual mark or a non-symmetrical pinextending from the socket housing 102 through the substrate 142.

[0037]FIGS. 5a-5 c illustrate various alternate substrate attachmentmechanisms, which may be an integral part of the socket housing 102(formed at the time of molding thereof). The substrate attachmentmechanisms shown in FIGS. 5a-5 c preferably extend through the substrate142 and a sufficient distance beyond to provide a robust attachment tothe substrate. Additionally, they should preferably be of sufficientthickness and durability to resist shearing (i.e., disassociation fromthe socket housing), fracture, or deformation from shock, vibration,and/or incidental contact. The substrate attachment mechanismspreferably allow removal of the component retention socket 100 from thesubstrate 142 with a reasonable amount of effort, and without renderingthe component retention socket 100 unusable. FIG. 5a illustrates thesubstrate attachment mechanisms 152 and 152′ as split pegs. FIG. 5billustrates the substrate attachment mechanisms 154 and 154′ as boardlocks. FIG. 5c illustrates the substrate attachment mechanisms 156 and156′ as threaded posts 158, 158′ and nuts 162, 162′.

[0038]FIGS. 5d-5 f illustrate additional substrate attachmentmechanisms. These substrate attachment mechanisms are used to ensureproper alignment of the lead guide channels 116, 116 with correspondingvias (not shown in FIGS. 5d-5 f) through the substrate 142. FIG. 5dillustrates the substrate attachment mechanisms 164 and 164′ asnon-locking guide pegs, which will not be attached to the substrate (notshown). The guide peg-type, substrate attachment mechanisms 164 and 164′may provide sufficient frictional attachment to hold the componentretention socket 100 in place while the soldering of the component leads(not shown) are used to attach both the component retention socket 100and the electronic component (not shown) to the substrate 142. FIG. 5eillustrates the substrate attachment mechanism 166 as a layer ofadhesive material. FIG. 5f illustrates the substrate attachmentmechanisms 168 as surface mounts, which are soldered to a top surface ofthe substrate, as known in the art.

[0039]FIGS. 6a and 6 b illustrate an alternative embodiment of acomponent retention socket 180. The component retention socket 180 isdesigned to require a minimum of substrate surface area and to use aminimum of material while retaining sufficient strength and utility. Thecomponent retention socket 180 may also include at least one extension182, which will be planar to the substrate when the component retentionsocket 180 is attached thereto.

[0040] Having thus described in detail embodiments of the presentinvention, it is understood that the invention defined by the appendedclaims is not to be limited by particular details set forth in the abovedescription, as many apparent variations thereof are possible withoutdeparting from the spirit or scope thereof.

What is claimed is:
 1. A component retention socket, comprising: ahousing having a first surface and a second surface; a recess definedwithin said housing, wherein said recess comprises a component chamberextending from said housing first surface to a component insertion stopwithin said housing and at least one lead guide channel extending fromsaid component insertion stop to said housing second surface; and saidat least one lead guide channel including at least one sloped wallextending from said component chamber.
 2. The component retention socketof claim 1, wherein said at least one sloped wall slopes from saidcomponent chamber to a point approximately one-quarter to one-third thedistance from said component insertion stop to said housing secondsurface.
 3. The component retention socket of claim 1, further includingat least one substrate attachment mechanism proximate said housingsecond surface.
 4. The component retention socket of claim 3, whereinsaid at least one substrate attachment mechanism is selected from thegroup consisting of solderable posts, split pegs, board locks, threadedposts and nuts, guide pegs, adhesive, and surface mounts.
 5. Thecomponent retention socket of claim 1, wherein said housing comprises apolycarbonate material.
 6. The component retention socket of claim 1,further including a beveled guide proximate said housing first surfacetapering into said component chamber.
 7. The component retention socketof claim 1, wherein said at least one lead guide channel furthercomprises a plurality of lead guide channels and further including alead separator between each of said lead guide channels.
 8. Thecomponent retention socket of claim 7, wherein said lead separatorincludes a separator wedge.
 9. An electronic device, comprising: asubstrate; a component retention socket attached to said substrate,wherein said component retention socket comprises: a housing having afirst surface and a second surface; a recess defined within saidhousing, wherein said recess comprises a component chamber extendingfrom said housing first surface to a component insertion stop withinsaid housing and at least one lead guide channel extending from saidcomponent insertion stop to said housing second surface; and said atleast one lead guide channel including at least one sloped wallextending from said component chamber; and an electronic componentresiding in said component chamber, wherein at least one lead of saidelectronic component extends through said at least one lead guidechannel and into at least one via in said substrate.
 10. The electronicdevice of claim 9, wherein said at least one sloped wall slopes fromsaid component chamber to a point approximately one-quarter to one-thirdthe distance from said component insertion stop to said housing secondsurface.
 11. The electronic device of claim 10, further including atleast one substrate attachment mechanism proximate said housing secondsurface.
 12. The electronic device of claim 11, wherein said at leastone substrate attachment mechanism is selected from the group consistingof solderable posts, split pegs, board locks, threaded posts and nuts,guide pegs, adhesive, and surface mounts.
 13. The electronic device ofclaim 9, wherein said housing comprises a polycarbonate material. 14.The electronic device of claim 9, further including a beveled guideproximate said housing first surface tapering into said componentchamber.
 15. The electronic device of claim 9, wherein said at least onelead guide channel further comprises a plurality of lead guide channelsand further including a lead separator between each of said lead guidechannels.
 16. The electronic device of claim 15, wherein said leadseparator includes a separator wedge.
 17. A method of fabricating anelectronic device, comprising: providing a substrate; abutting acomponent retention socket, having a recess defined therein, againstsaid substrate; inserting an electronic component into said socketrecess, wherein at least one lead of said electronic component extendsthrough at least one lead guide channel in said component retentionsocket and into at least one via in said substrate; and attaching saidat least one component lead to said substrate.
 18. The method of claim17, wherein abutting said component retention socket against saidsubstrate comprises attaching said component retention socket to saidsubstrate with a substrate attachment mechanism.
 19. The method of claim18, wherein attaching said component retention mechanism comprisesattaching said component mechanism to said substrate with a substrateattachment mechanism selected from the group consisting of solderableposts, split pegs, board locks, threaded posts and nuts, guide pegs,adhesive, and surface mounts.
 20. The method of claim 17, whereinabutting a component retention socket to said substrate compriseabutting a polycarbonate material component retention socket.